TMP-EX Heat Sink
Description
Momentive Technologies offers a unique heat sink product that contains a TPG* core (~1700 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance.
The TMP-EX composite heat sink provides:
- High thermal conductivity
- CTE matching to semiconductors
- Light weight
Applications
- Aerospace
- Power electronic package
- RF & microwave package
- Laser diode
- High power LED
Features and Benefits
Typical Physical Properties
- Parallelism: 0.0005″ (0.01mm)
- Flatness: 0.001″/1″ (1μm/1mm)
- Surface Finish: Ra 16 μin (0.4 μm)
- Plating: Ni 160-250 μin (4-6 μm) / Au 40-80 μin (1-2 μm)
Reliability
Packaging standards (MIL-STD-883H) qualified:- Hermeticity
- Thermal cycling
- Shock & vibration resistances
Comparison of Measured Thermal Conductivity
Technical Specs
Schematic Illustration of CTE Matched TMP-EX Heat Sink
Comparison of Simulated Thermal Performance
Typical Materials Properties
| Material | In-Plane TC (W/m•K) | Thru-Plane TC (W/m•K) | In-Plane CTE (ppm/°C) | Density (gm/cm³) |
|---|---|---|---|---|
|
Aluminum |
218 |
218 |
23 |
2.7 |
|
Copper |
400 |
400 |
17 |
8.9 |
|
TMP-EX (AlSiC12)(1) |
1060 |
435 |
11 |
2.5 |
|
W85Cu |
190 |
190 |
7.0 |
15.6 |
|
TMP-EX (W85Cu)(1) |
1063 |
455 |
7.0 |
6.7 |
|
Mo70Cu |
1063 |
1063 |
1063 |
1063 |
|
TMP-EX (Mo70Cu)(1) |
1063 |
1063 |
1063 |
1063 |
(1) Estimation is based on 67% TPG loading.
Standard off-the-shelf parts are available upon request.
Note: Typical properties are average data and are not to be used as or to develop specifications.
*TPG is a trademark of Momentive Performance Materials Inc.
