Ceramics Products

Spherical Silica

MEGASIL™ SS

Spherical Silica powders are used in the production of Epoxy Moulding Compounds (EMCs) and green EMCs (halogen-free, antimony-free), which are thermosetting materials encapsulating and protecting semiconductor devices (e.g., memory integrated circuits (ICs) tied to 5G and IoT devices) from physical and environmental damage. Applications: consumer, automotive, and industrial electronics.

GRANULOMETRIC DATA & PHYSICAL CHARACTERISTICS (LOW-a GRADES)

Mean values. These do not represent a specification.

Size SS-U130R SS-U130H4 SS-U052H2 SS-U020H Method
% Passing on Ind. Sieve
<2μm
7.22
12.12
11.86
36.31
%
CILAS Laser
% Passing on Ind. Sieve
<5μm
24.1
32.02
50.71
86.94
%
CILAS Laser
% Passing on Ind. Sieve
<8μm
34.55
40.29
80.22
98.30
%
CILAS Laser
% Passing on Ind. Sieve
<12μm
46.33
49.63
95.07
100.00
%
CILAS Laser
% Passing on Ind. Sieve
<25μm
66.78
77.56
100.00
100.00
%
CILAS Laser
% Passing on Ind. Sieve
<45μm
90.09
98.96
100.00
100.00
%
CILAS Laser
% Passing on Ind. Sieve
<75μm
99.76
100.00
100.00
100.00
%
CILAS Laser
Particle Size
D10
2.36
1.83
1.87
1.06
μm
CILAS Laser
Particle Size
D50
13.56
12.16
4.94
2.51
μm
CILAS Laser
Particle Size
D90
13.56
12.16
4.94
2.51
μm
CILAS Laser
Moisture Content
0.01
0.01
0.01
0.02
wt.%
105°C oven
pH Value
4.81
4.49
5.25
4.50
pH meter
Specific Gravity
2.21
2.21
2.21
2.21
pycnometer
Electrical Conductivity
2.3
1.70
0.40
6.40
μs/cm
E.C meter
Specific Surface Area
4.5
3.86
1.16
28.20
m2/g
BET
Circularity
0.97
0.95
0.97
FPIA

CHEMICAL ANALYSIS (XRF)

SS-U130R SS-U130H4 SS-U052H2 SS-U020H Method
SiO2
99.8
99.9
99.9
99.9
ppm
XRF
Al2O3
826
491
129
654
ppm
XRF
Fe2O3
47
48
40
133
ppm
XRF
Na2O
47
15
25
32
ppm
XRF

IONIC IMPURITIES (IC)

SS-U130R SS-U130H4 SS-U052H2 SS-U020H Method
Na+
2.4
1.0
1.1
8.4
ppm
I.C
Cl
1.3
0.4
0.9
1.4
ppm
I.C

GRANULOMETRIC DATA & PHYSICAL CHARACTERISTICS (STANDARD GRADES, BLENDED TYPE)

Mean values. These do not represent a specification.

Size SS-0140R SS-0160R SS-0160H SS-0170R SS-0140C5 Method
% Passing on Ind. Sieve
<2μm
7.98
8.99
8.16
8.29
36.31
%
CILAS Laser
% Passing on Ind. Sieve
<5μm
25.73
27.76
30.96
26.04
27.84
%
CILAS Laser
% Passing on Ind. Sieve
<8μm
34.00
37.29
40.17
35.80
36.50
%
CILAS Laser
% Passing on Ind. Sieve
<12μm
42.67
47.68
47.59
43.00
45.61
%
CILAS Laser
% Passing on Ind. Sieve
<25μm
59.71
67.73
62.03
60.46
64.61
%
CILAS Laser
% Passing on Ind. Sieve
<45μm
88.01
90.70
86.86
86.90
91.94
%
CILAS Laser
% Passing on Ind. Sieve
<75μm
99.74
99.80
99.61
99.63
99.91
%
CILAS Laser
Particle Size
D10
2.24
2.11
2.23
2.20
2.12
μm
CILAS Laser
Particle Size
D50
16.71
13.08
13.60
16.49
12.98
μm
CILAS Laser
Particle Size
D90
47.23
44.15
48.58
48.46
42.45
μm
CILAS Laser
Moisture Content
0.01
0.01
0.01
0.01
0.01
wt.%
105°C oven
pH Value
4.45
4.50
4.50
4.54
4.40
pH meter
Specific Gravity
2.21
2.21
2.21
2.21
2.21
pycnometer
Electrical Conductivity
1.70
1.70
1.70
1.30
2.20
μs/cm
E.C meter
Specific Surface Area
3.20
4.90
3.90
3.70
4.10
m2/g
BET
Circularity
0.95
0.95
0.95
0.95
0.96
FPIA

CHEMICAL ANALYSIS (XRF)

SS-0140R SS-0160R SS-0160H SS-0170R SS-0140C5 Method
SiO2
99.8
99.8
99.8
99.8
99.8
%
XRF
Al2O3
1119
998
898
926
1189
ppm
XRF
Fe2O3
75
50
38
51
67
ppm
XRF
Na2O
59
43
19
53
26
ppm
XRF

IONIC IMPURITIES (IC)

SS-0140R SS-0160R SS-0160H SS-0170R SS-0140C5 Method
Na+
1.8
2.2
1.3
1.7
2.0
ppm
I.C
Cl
2.1
1.3
1.3
1.5
1.8
ppm
I.C

GRANULOMETRIC DATA & PHYSICAL CHARACTERISTICS (STANDARD GRADES, SINGULAR COMPONENT)

Mean values. These do not represent a specification.

Size SS-0030 SS-0090 SS-0250 SS-0300 Method
% Passing on Ind. Sieve
<2μm
12.23
8.9
4.68
4.73
%
CILAS Laser
% Passing on Ind. Sieve
<5μm
53.92
26.74
12.91
14.63
%
CILAS Laser
% Passing on Ind. Sieve
<8μm
72.26
43.04
17.09
19.78
%
CILAS Laser
% Passing on Ind. Sieve
<12μm
86.45
67.14
24.33
27.20
%
CILAS Laser
% Passing on Ind. Sieve
<25μm
99.42
96.99
48.14
47.51
%
CILAS Laser
% Passing on Ind. Sieve
<45μm
100
100
80.53
78.05
%
CILAS Laser
% Passing on Ind. Sieve
<75μm
100
100
99.63
99.48
%
CILAS Laser
Particle Size
D10
1.65
2.12
3.46
3.20
μm
CILAS Laser
Particle Size
D50
4.55
9.09
26.04
26.70
μm
CILAS Laser
Particle Size
D90
13.59
18.73
53.26
54.94
μm
CILAS Laser
Moisture Content
0.02
0.01
0.01
0.01
wt.%
105°C oven
pH Value
4.14
4.86
4.96
5.01
pH meter
Specific Gravity
2.21
2.21
2.21
2.21
pycnometer
Electrical Conductivity
4.8
1.7
0.80
0.90
μs/cm
E.C meter
Specific Surface Area
11.6
1.6
1.1
0.9
m2/g
BET
Circularity
0.85
0.91
0.85
0.87
FPIA
Sieve Residue
45 μm On
0.14
0.04
11.58
11.93
wt.%
Wet Sieve
Sieve Residue
75 μm On
0
0
0.02
0.02
wt.%
Wet Sieve
Sieve Residue
106 μm On
0
0
0
wt.%
Wet Sieve

CHEMICAL ANALYSIS (XRF)

SS-0030 SS-0090 SS-0250 SS-0300 Method
SiO2
99.7
99.8
99.8
99.8
%
XRF
Al2O3
1216
610
597
1040
ppm
XRF
Fe2O3
86
43
48
48
ppm
XRF
Na2O
55
43
40
40
ppm
XRF

IONIC IMPURITIES (IC)

SS-0030 SS-0090 SS-0250 SS-0300 Method
Na+
2.8
2.4
1.3
0.8
ppm
I.C
Cl
2.4
2.6
1.1
1.3
ppm
I.C

Potential Applications

  • Consumer
  • Automotive
  • Industrial Electronics

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Spherical Silica – Megasil

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Spherical Silica – Megasil

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台湾办事处

No. 6, 10th Floor, No. 65, Gaotie 7th Road, Zhubei City, Hsinchu, Taiwan

中国办事处

No. 1088 Yuanshen road, Suite 1101 Ping’an Fortune Building, Shanghai 200122, China

+86 21 5848 1388

한국사무소

Momentive Technologies Korea Ltd.

7F of WONIK Building, 20, Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do,
Republic of Korea

+82 31 8038 9069

日本オフィス

Momentive Technologies Japan KK

Park West 10th floor, 6-12-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023,
Japan

+81 3 6721 1910