Thermal Fillers Enable Next-Gen Thermal Management for Electric Vehicles

As illustrated in the table below, among all the typical ceramic thermal fillers used in developing dielectric thermally conductive polymer composites, high purity crystalline hexagonal boron nitride (h-BN) and silica are the only two ceramic fillers with dielectric constants <4. Therefore, both have been popular as thermal fillers in polymer based thermal management materials for high frequency applications. The enhanced performance (power) and higher integration density of next generation high frequency devices inevitably drive up the power density which results in substantially increased heat to be dissipated within shrinking space. High purity h-BN powder, which has the highest thermal conductivity, highest electric resistivity, and lowest hardness, now has been the most attractive thermal fillers for high performance thermal management materials used in high frequency environment.